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GLOBALFOUNDRIES is the foundry technology leader. Technology leadership in foundry requires much more than an early offering of a design kit for risk production at the next leading edge node. For their commercial success, customers depend upon a foundry's ability to rapidly ramp a technology to production at high volume with low defect densities and low leakage. During the transition to the 45/40nm technology generation, GLOBALFOUNDRIES reached volume production at mature yield far ahead of the rest of the foundry industry, while simultaneously implementing immersion lithography ahead of all other semiconductor manufacturers. It is now tapping this heritage of leading-edge manufacturing excellence to deliver comprehensive product solutions to a broad range of customers.

GLOBALFOUNDRIES' ability to offer advanced process technology is powered by its highly successful and efficient collaborative R&D model centered on the joint development alliance (JDA) with seven world leading product companies including Freescale, IBM, Infineon, NEC, ST, Samsung, and Toshiba. With this alliance, GLOBALFOUNDRIES is driving the global standard for new technologies such as High K Metal Gate, with risk production at 32nm and 28nm in 2010. As a founding member of the JDA starting from 90nm, GLOBALFOUNDRIES has been able to leverage the collaborative R&D model to reduce the cost of process R&D that is projected to reach more than $1B US for 22nm and below. GLOBALFOUNDRIES embraces a collaborative approach to innovation that combines a shared objective with a shared investment strategy with partners around the world. The company's partnerships range from early-stage R&D, to the evaluation of production-ready process technologies, to the enablement of physical design kits (PDK), to the shared IPs, and finally to the services and support provided by 3rd party design partners. The company's goal is to provide its customers accelerated access to the most advanced technologies, manufacturing processes and design solutions available. The company's goal is to provide its customers accelerated access to the most advanced technologies, manufacturing processes and design solutions available.

Broad Technology Strategy

GLOBALFOUNDRIES is harnessing its leadership in a broad range of technologies to provide customers with three categories of process technologies. With technologies ranging from Leading-Edge, Advanced and Base, GLOBALFOUNDRIES provides a breadth and depth of solutions that addresses the diversity and customer that are reliant on semiconductor products.

Leading-Edge technologies includes 45nm and smaller geometries with 45nm products in current production. Advanced technologies include 90nm and 65nm process geometries, and Base technologies include 0.11um and larger geometries. Valued-Added-Solution process modules such as Non-Volatile Memories, High Voltage and RF are available across the various process geometries.

 

 

  
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